Description
Master Extreme Ultraviolet Lithography Techniques
Produce high-density, ultrafast microchips the use of the contemporary EUVL methods. Written by industry experts, Extreme Ultraviolet Lithography main points the equipment, materials, and procedures required to radically extend fabrication capabilities to wavelengths of 32 nanometers and below. Work with masks and resists, configure high-reflectivity mirrors, conquer power and thermal challenges, reinforce resolution, and minimize wasted energy. You are going to also learn to use Mo/Si deposition technology, fine-tune performance, and optimize cost of ownership.
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Design EUVL-able photomasks, withstand layers, and source-collector modules
- Assemble optical components, mirrors, microsteppers, and scanners
- Harness laser-produced and discharge pulse plasma sources
- Enhance resolution the use of proximity correction and phase-shift
- Generate modified illumination the use of holographic elements
- Measure vital dimensions the use of metrology and scatterometry
- Deploy stable Mo/Si coatings and high-sensitivity multilayers
- Handle mask defects, layer imperfections, and thermal instabilities